Infineon becomes first to produce power silicon carbide on 300mm wafers

Infineon marks innovation milestone with 300mm power silicon carbide wafer

Infineon becomes first to produce power silicon carbide on 300mm wafers

Infineon has fabricated power silicon carbide devices on 300mm wafers, a world first that moves SiC from the 200mm norm to the larger format used for mainstream silicon. Bigger wafers mean more dies per run and lower cost per chip, which matters for electric vehicles and industrial power electronics, where SiC's efficiency gains have long been undercut by price.

Infineon marks innovation milestone with world's first 300mm power silicon carbide wafer.
  1. BrandiATMuhkuh

    What surprises me with Infineon is that they seem to not work on a LLM on a chip. In particular that here in Linz Infineon, Apple's 5G modem designer and the Johannes Kepler University with Sepp Hochreiter (Inventor of LSTM) are just next to each other.

    I watched a interview of Infineon head of AI just recently, and I was like excited to hear about some cool hardware. And all he did is talk about how he uses LLMs.

  2. bradknowles

    The summary at the top of that page is:

    Infineon marks innovation milestone with world’s first 300-millimeter power silicon carbide (SiC) wafer

    PBusiness & Financial Press

    Nov 09, 2026

    Infineon presents industry-first functional power devices processed on 300-millimeter silicon carbide wafers

    Technological breakthrough underlines Infineon’s innovation strength and leadership in power semiconductors and wide-bandgap technologies

    300-millimeter SiC process feasibility lays the foundation for secure, future-proof SiC supply to customers in automotive, renewable energy, industrial and AI data center applications

    Infineon will present the first processed 300-millimeter SiC wafer to the public at the electronica trade show starting 10 November 2026 in Munich

  3. johntb86

    Anyone know why it took so long for them to transition to 300mm? As mentioned in the article, they're mainly using existing 300mm equipment designed for silicon, which transitioned years ago. I imagine some process steps are different (mainly growing to larger boule, but probably others), but it doesn't seem like they would be huge blockers.

  4. novaRom

    Can you guys restart DRAM production in Europe again? If 20 or so years ago it was possible, today is the best economical opportunity.

  5. mercurywells

    I thought Wolfspeed was already at 300mm at the start of this year?

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