Samsung to Double HBM4 Output Next Year as Glass Carrier Orders Jump 2.5x
Samsung is expected to more than double output of its HBM4 and HBM4E DRAM
Samsung Electronics is set to more than double production of its HBM4 and HBM4E memory chips next year, with monthly HBM wafer capacity rising from about 180,000 to 250,000. Outsourced glass carrier cleaning volume will jump from 20,000 to 50,000 sheets a month, a signal that high-layer stacking is scaling fast. The HBM4 family should make up 80% of shipments, up from 40% this year.
Even accounting for the fact that glass carriers are reused after cleaning and that consumption varies by process loading method and yield, a 2.5-fold increase in related volume makes it highly likely that HBM4 and HBM4E output will grow at least twofold from this year.